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Rigid Printed Circuit boards
- Layer Count:
- Single Sided through 12-Layer
- Blind/Buried Via Configurations
- Copper Weight:
- Thickness:
- Inner Layer Dielectrics .004" Minimum
- Maximum Thickness .250"
- Surface Finish:
- Solder (63/37 Tin-Lead)
- Immersion Gold (ENIG)
- Immersion Tin
- Immersion Silver
- SN100C (Lead-free Solder)
- OSP
- Hard Gold Fingers
- Carbon Ink
- Electro-Plated Gold
- Laminate:
- FR-4 - All types & temperatures.
- Thermagon - Single layer through multilayer.
- Getek, FR-408 & 4000-13 - For critical Signal Integrity requirements.
- Polyimide - Single layer through multilayer
- Composite materials - Including Rogers 4003 & Cynate Ester
- Teflon - All manufacturers. Pure Teflon or Hybrid constructions.
Aluminum Backed Circuit Boards:
- Layer Count:
- Single Sided through 12-Layer
- Blind/Buried Via Configurations
- Copper Weight:
- Thickness:
- Inner Layer Dielectrics .004" Minimum
- Maximum Thickness .250"
- Surface Finish:
- Solder (63/37 Tin-Lead)
- SN100C (Lead-free Solder)
- OSP
- Carbon Ink
- Laminate:
- Thermagon - Single layer through multilayer.
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