|
Capabilities
Facility Tour
Directions
|
The Amitron Corporation teams of professionally trained CAD/CAM engineers assure a seamless transition of your engineering data to the manufacturing floor. The following information outlines our engineering and manufacturing capabilities.
Data Formats
|
- Gerber 274D
- Gerber 274X (imbedded apertures)
- DXF
- PDF
- HPGL
- Auto cad
- ASCII or EIA NC drill files
|
|
CAM Capabilities |
Dual photocircuit plotters- Valor Genesis software
- Micro-modifications performed with customer approval
- Panel/array optimization available
- Pre-manufacturing design checks on every part
- Artwork generation from bare boards or blueprints
- Net list test fixture generation
|
|
Process Options
|
- Solder mask over bare copper
- Gold tab plating
- Electroless nickel Immersion gold ENIG
- Immersion Silver
- Carbon ink
- Entek OSP
- Immersion tin
- Lead free HASL
- Solder mask: LPI & SR1000
- CNC skip scoring
|
|
PCB Process Capabilities |
- Laminate Types: FR-4, FR-406, FR-408, IS410 (all UL94V-0 rated), Arlon, Getek, Rogers, Thermagon, Nelco and more!
- Laminate Thickness: 0.004" to 0.250"
- Copper Weight: 1/2 ounce to 12 ounce, finished
- Layer Count: Single, Double, 4, 6, 8, 10, 12
- Line & Space Widths: 0.005"/0.005"
|
Mechanical Process Tolerances |
Minimum annular ring
Board edge to edge, routed
Tooling hole to hole:
Tooling hole to edge:
Holes to copper registration:
Top to bottom registration:
Image line tolerance:
Scoring tolerance:
Edge to copper:
Minimum Solder mask clearance:
Minimum hole size:
Minimum inside radius:
Minimum trace width:
Pad to pad clearance:
Hole diameter:
Board thickness:
|
.004"
+/- 0.005"
+/- 0.002"
+/- 0.005"
+/- 0.005"
+/- 0.003"
90% art work
+/- 0.005"
+/- 0.010"
0.002"
0.010"
0.015"
0.005"
0.007"
+/- 0.0025"
+/- 8%
|
|
