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Capabilities

The Amitron Corporation teams of professionally trained CAD/CAM engineers assure a seamless transition of your engineering data to the manufacturing floor. The following information outlines our engineering and manufacturing capabilities.

Data Formats

Capabilities

  • Gerber 274D
  • Gerber 274X (imbedded apertures)
  • DXF
  • PDF
  • HPGL
  • Auto cad
  • ASCII or EIA NC drill files

CAM Capabilities

  • Dual photocircuit plotters
  • Valor Genesis software
  • Micro-modifications performed with customer approval
  • Panel/array optimization available
  • Pre-manufacturing design checks on every part
  • Artwork generation from bare boards or blueprints
  • Net list test fixture generation

Process Options

Capabilities

  • Solder mask over bare copper (SMOBC)
  • Gold tab plating
  • Electroless nickel Immersion gold (ENIG)
  • Immersion Silver
  • Carbon ink
  • Entek Organic Surface Protectant (OSP)
  • Immersion tin
  • Lead Free Hot Air Solder Level (LF-HASL)
  • Solder mask: LPI & Thermal options available
  • CNC skip scoring

PCB Process Capabilities

Laminate Types:
FR-4 (140Tg, 170Tg, 180Tg) (all UL94V-0 rated), RF and Teflon, Arlon, Getek, Rogers, Nelco and more!  Thermal materials including Laird, Arlon, Ventec, Iteq and Chin-Shi, bonded to Aluminum or Copper.
Laminate Thickness:
0.003" to 0.250"
Copper Weight:
1/2 ounce to 20 ounce, finished
Layer Count:
Single, Double, 3, 4, 6, 8, 10, 12, 14, 16, 18, 20
Line & Space Widths:
0.003"/0.003"

Mechanical Process Tolerances

Minimum annular ring:
.004"
Board edge to edge, routed:
+/- 0.005"
Tooling hole to hole:
+/- 0.002"
Tooling hole to edge:
+/- 0.005"
Holes to copper registration:
+/- 0.003"
Top to bottom registration:
+/- 0.003"
Image line tolerance:
90% art work
Scoring tolerance:
+/- 0.005"
Edge to copper:
+/- 0.008"
Minimum Solder mask clearance:
0.002"
Minimum hole size:
0.008"
Minimum inside radius:
0.012"
Minimum trace width:
0.003"
Pad to pad clearance:
0.007"
Hole diameter: (plated thru)
+/- 0.0025"
Hole diameter: (non-plated up to .250")
+/- 0.001"
Board thickness:
+/- 8%